Re: Wii bit smaller: Revisions, Die shrinks, Layers, and mor
Nothing significant.
-The CPU-60:
--99% the same as CPU-40, only one difference
--1 voltage line uses a more efficient regulator. No other differences found so far
--Draws .05-.07 amps less than cpu-40 under same conditions (@12v)
After further sanding of the cpu-40 board:
-I can now confirm that top layer 2 (aka top hidden layer) is entirely gnd
Im assuming this applies to the cpu-60 as well
The board is 4 layers:
Top Layer 1: Visible Traces
Top Layer 2: GND (1 single copper sheet)
(Board part of the board)
Bottom Layer 2: Voltage sections
Bottom Layer 2: Visible traces
Im still sticking with the 40 though, because it has been much more common, and I hope to eventually replace the regulators anyway.
Here are my current objectives/issues:
-The system wont start without a bluetooth or wifi chip. I want to figure out how it detects it and find a way to spoof it.
-I need to figure out exactly how many voltage sections are. For example, there is more than 1 3.3v line, one of which goes to the MX chip (I think.)
-I need to figure out how to complete the diagram of the voltage layer. Im having trouble successfully sanding down my boards to reveal the voltage layer without destroying bits of it. If you can sand a board, speak up, and I may send one to you for free.
I also want to figure out which data lines are highspeed and how sensitive they are. Some have squiggly traces which hint that they are. Here are the lines in question.
-Traces to Disc drive connector; has squiggly traces
-traces to wifi module; some squiggly traces
-traces to SD card; Squiggly traces, dont think its highspeed
-traces to Flash Memory chip; no squiggles. Curious if it can be relocated
-traces to MX chip: no squiggles as far as I know. Curious if it can be relocated
-traces to Bluetooth chip: Haven't seen squiggles. Curious if it can be relocated
If the components use sensitive high speed data lines, they cannot be relocated, and will cease to function if rewired because... reasons. If they do not have high speed data lines, then they can be moved. Relocating the above components will decrease the footprint of the board substantially. If you have any information, speak now. I need help.